Harmonized Tariff Schedule of the U.S. › Chapter 84 Nuclear reactors, boilers, machinery and mechanical appliances; parts thereof

8486.10.00.00Tariff line

Classification path

Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays; machines and apparatus specified in note 11(C) to this chapter; parts and accessories

8486

Machines and apparatus for the manufacture of boules or wafers

8486.10.00.00

Rates of duty

General rate (Column 1)Free

Special—

Column 235%

UnitNo.

Printed page 2862

Measure flags

for origin CN, entry date 2026-10-26 · base rate Free

Section 301 forced-labor tariff (12.5%)9903.05.86ExemptexemptOn the note 52(b) general exemption list (exempt by HTS line; enter under 9903.05.86)
China 301 List 2 (9903.88.02)9903.88.02Applies+25%8-digit subheading 8486.10.00 is on L2
301 exclusion 9903.88.70 (by product description)9903.88.70ConditionalexemptSilicon growth furnaces, including Czochralski crystal growth furnaces, designed for growing monocrystalline silicon ingots (boules) of a mass exceeding 700 kg, for use in solar wafer manufacturing — only the products described; expires 2026-11-09 11:59 p.m. EDT
301 exclusion 9903.88.70 (by product description)9903.88.70ConditionalexemptBand saws designed for cutting or slicing cylindrical monocrystalline silicon ingots (boules) of an initial mass exceeding 400 kg into square or rectangular ingots (boules), for use in solar wafer manufacturing — only the products described; expires 2026-11-09 11:59 p.m. EDT
301 exclusion 9903.88.70 (by product description)9903.88.70ConditionalexemptMachines designed to align and adhere square or rectangular monocrystalline silicon ingots (boules) of an initial mass exceeding 200 kg to plastic support boards on metal mounting plates to provide support during diamond wire sawing, for use in solar wafer manufacturing — only the products described; expires 2026-11-09 11:59 p.m. EDT
301 exclusion 9903.88.70 (by product description)9903.88.70ConditionalexemptDiamond wire saws designed for cutting or slicing square or rectangular monocrystalline silicon ingots (boules) of an initial mass exceeding 400 kg into solar wafers of a thickness not exceeding 200 micrometers — only the products described; expires 2026-11-09 11:59 p.m. EDT
301 exclusion 9903.88.70 (by product description)9903.88.70ConditionalexemptWire guide roller machines, presented with diamond wire saws designed for slicing square or rectangular monocrystalline silicon ingots (boules) of an initial mass exceeding 400 kg into solar wafers of a thickness not exceeding 200 micrometers, all of the foregoing for use in solar wafer manufacturing — only the products described; expires 2026-11-09 11:59 p.m. EDT
301 exclusion 9903.88.70 (by product description)9903.88.70ConditionalexemptCoolant fluid recycling machines, presented with diamond wire saws designed for slicing square or rectangular monocrystalline silicon ingots (boules) of an initial mass exceeding 400 kg into solar wafers of a thickness not exceeding 200 micrometers, all of the foregoing for use in solar wafer manufacturing — only the products described; expires 2026-11-09 11:59 p.m. EDT
301 exclusion 9903.88.70 (by product description)9903.88.70ConditionalexemptDegumming machines designed to remove adhesives from solar wafers — only the products described; expires 2026-11-09 11:59 p.m. EDT

Confirmed total 25% · max 25%Full duty breakdown →

U.S. → China →