DutyDesk美国关税台DutyDesk · HTSUS Rev.21 · 更新 2026-10-26
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美国协调关税表(HTSUS) › 第 84 章 核反应堆、锅炉、机器、机械器具及其零件

8486.10.00.00税号详情

归类路径

Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays; machines and apparatus specified in note 11(C) to this chapter; parts and accessories
8486
Machines and apparatus for the manufacture of boules or wafers
8486.10.00.00

税率

普通税率(第 1 栏)Free
特殊税率—
第 2 栏35%
单位No.

印本页码 2862

措施提示

按原产国 CN、进口日期 2026-10-26 计算 · 基础税率 Free

  • 强迫劳动 301 附加税(12.5%)9903.05.86免免note 52(b) 通用豁免清单税号(按税号即免,申报 9903.05.86)
  • 对华 301 List 2(9903.88.02)9903.88.02适用+25%8 位税号 8486.10.00 在 L2 清单内
  • 301 豁免 9903.88.70(按产品描述)9903.88.70视条件免Silicon growth furnaces, including Czochralski crystal growth furnaces, designed for growing monocrystalline silicon ingots (boules) of a mass exceeding 700 kg, for use in solar wafer manufacturing——仅限描述所列产品;到期 2026-11-09 11:59 p.m. EDT
  • 301 豁免 9903.88.70(按产品描述)9903.88.70视条件免Band saws designed for cutting or slicing cylindrical monocrystalline silicon ingots (boules) of an initial mass exceeding 400 kg into square or rectangular ingots (boules), for use in solar wafer manufacturing——仅限描述所列产品;到期 2026-11-09 11:59 p.m. EDT
  • 301 豁免 9903.88.70(按产品描述)9903.88.70视条件免Machines designed to align and adhere square or rectangular monocrystalline silicon ingots (boules) of an initial mass exceeding 200 kg to plastic support boards on metal mounting plates to provide support during diamond wire sawing, for use in solar wafer manufacturing——仅限描述所列产品;到期 2026-11-09 11:59 p.m. EDT
  • 301 豁免 9903.88.70(按产品描述)9903.88.70视条件免Diamond wire saws designed for cutting or slicing square or rectangular monocrystalline silicon ingots (boules) of an initial mass exceeding 400 kg into solar wafers of a thickness not exceeding 200 micrometers——仅限描述所列产品;到期 2026-11-09 11:59 p.m. EDT
  • 301 豁免 9903.88.70(按产品描述)9903.88.70视条件免Wire guide roller machines, presented with diamond wire saws designed for slicing square or rectangular monocrystalline silicon ingots (boules) of an initial mass exceeding 400 kg into solar wafers of a thickness not exceeding 200 micrometers, all of the foregoing for use in solar wafer manufacturing——仅限描述所列产品;到期 2026-11-09 11:59 p.m. EDT
  • 301 豁免 9903.88.70(按产品描述)9903.88.70视条件免Coolant fluid recycling machines, presented with diamond wire saws designed for slicing square or rectangular monocrystalline silicon ingots (boules) of an initial mass exceeding 400 kg into solar wafers of a thickness not exceeding 200 micrometers, all of the foregoing for use in solar wafer manufacturing——仅限描述所列产品;到期 2026-11-09 11:59 p.m. EDT
  • 301 豁免 9903.88.70(按产品描述)9903.88.70视条件免Degumming machines designed to remove adhesives from solar wafers——仅限描述所列产品;到期 2026-11-09 11:59 p.m. EDT

确定合计 25% · 上限 25%查看完整关税明细 →

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